LTS 575: Solder Joint Separation During Second Reflow Induced by VIPPO Structures: Mechanism and Modeling Methodology Study

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Veröffentlicht in:SMTA International Conference (2021 : Minneapolis, Minn.; Online) 2021 SMTA International Conference ; Volume 2 of 2
1. Verfasser: Xie, Weidong (VerfasserIn)
Weitere Verfasser: Perng, Steven (VerfasserIn), Lee, Tae-Kyu (VerfasserIn)
Pages:2021
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Sprache:eng
Veröffentlicht: 2022
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