SURFACE NANOPARTICLE MONITORING FOR PLASMA ETCHING CHAMBER COMPONENTS USING SINGLE PARTICLE - ICP-MS

SURFACE NANOPARTICLE MONITORING FOR PLASMA ETCHING CHAMBER COMPONENTS USING SINGLE PARTICLE - ICP-MS

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Surface Preparation and Cleaning Conference (2022 : Chandler, Ariz.) 2022 Surface Preparation and Cleaning Conference
1. Verfasser: Mey, L. (VerfasserIn)
Pages:2022
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2023
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
GLASS WAFER BACKSIDE OPAQUE LAYER REMOVAL ON 300MM FABRICATION TOOL FOR ADVANCED PACKAGING 2023 Lai, J.
ELIMINATION OF SURFACE PARTICLES WITH PARALLEL STREAK SIGNATURE BY OPTIMIZING POST CMP CLEANS 2023 Desamito, J.
SINGLE WAFER PATTERN COLLAPSE EVALUATIONS 2023 Zu, X.
CORRELATION BETWEEN AEROSOLIZATION BASED METROLOGY AND ENHANCED SURFACE SCANNING 2023 Oberreit, D.
HYDROXYLAMINE FREE FORMULATION DEVELOPMENT FOR POST ETCH RESIDUE CLEANING 2023 Sun, L.
SUSTAINABLE, HIGHLY-EFFICIENT WATER-BASED ADN NMP-FREE THROUGH SILICON VIAS CLEANING FOR QUANTUM COMPUTER INTERCONNECTS INTREGRATION 2023 Breul, A.
WET CHEMICAL ETCHING OF SI1-XGEX IN HNO3: HF: H2O 2023 Zhang, H.
A NOVEL SELECTIVE ADSORPTION POLYMER TO SILICON NITRIDE ENABLES ETCHING SELECTIVITY CONTROL IN HF AND BHF ETCHING 2023 Mohcida, K.
DIFFUSING CHEMISTRY INTO HIGH ASPECT-RATIO MICROSTRUCTURES THROUGH VACUUM TECHNOLOGY 2023 Kashkoush, I.
DEVELOPMENT OF UV-ASSISTED ELECTROCHEMICAL ETCHING 2023 Higuchi, R.
WET CLEANS AND SURFACE PREPARATION FOR AUGMENTED REALITY (AR) DEVICE FABRICATION: CHALLENGES AND NOVEL TECHNOLOGY DEVELOPMENTS 2023 Oriero, D.
CHARACTERIZATION OF IMPURITIES FROM INCOMING PVA BRUSH FOR SUB 10 NM POST CMP CLEANING PROCESS 2023 Han, K.
OPTIMIZATION OF DUMMY POLY-SILICON REMOVAL IN HIGH-K METAL GATE PROCESS 2023 Wei, X.
SEARCHING FOR SUSTAINABILITY IN THE AI MICROELECTRONICS INDUSTRY 2023 Freeman, D.
PARTICLE PRECURSORS – A NONOBVIOUS SOURCE OF DEFECTIVITY ISSUES 2023 Schooneveld, G.
EXTREME SILICON THINNING FOR BACK SIDE POWER DELIVERY NETWORK APPLICATION: NEED FOR A HIGHLY SELECTIVE ALKALINE SILICON ETCH STOPPING ON SIGE ETCH STOP LAYER 2023 Sebaai, F.
SILICON ETCHING UTILIZING NEAR-INFRARED AND H2 MITIGATION IN MEMS APPLICATIONS 2023 Kashkoush, I.
WAFER ANALYSIS FOR CONTAMINATION 2023 Chia, V.
THROUGH SILICON VIAS CLEANING FOR QUANTUM COMPUTER INTERCONNECTS INTEGRATION 2023 Tulzo, H.
IDM PERSPECTIVE OF ADVANCED NODES MATERIALS, DEFECTIVITY AND ANALYTICAL METROLOGY CHALLENGES 2023 Sengupta, A.
Alle Artikel auflisten