Investigating Inter-Weld Bonds Under Tension in Mechatronic AM Processing TP20-0000000205

Investigating Inter-Weld Bonds Under Tension in Mechatronic AM Processing TP20-0000000205

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Bibliographische Detailangaben
Veröffentlicht in:CAMX (2020 : Online) Composites and Advanced Materials Expo (CAMX 2020)
1. Verfasser: Psulkowski, Sean (VerfasserIn)
Weitere Verfasser: Frketic, Jolie (VerfasserIn), Parker, Helen (VerfasserIn), Werner, Raquel (VerfasserIn), Dickens, Tarik (VerfasserIn)
Pages:2020
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2021
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