Thermal Fatigue Life of Micro-Solder Interconnections

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Veröffentlicht in:Symposium on Reliability and Maintainability (13. : 1983 : Tokio) 13th Symposium on Reliability and Maintainability
1. Verfasser: Satoh, Ryohei (VerfasserIn)
Weitere Verfasser: Ohshima, Muneo (VerfasserIn), Serizawa, Kohji (VerfasserIn), Ishi, Ichiro (VerfasserIn)
Pages:13
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 1983
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