IPACK2020-2533 Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers

IPACK2020-2533 Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers

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Veröffentlicht in:ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020
1. Verfasser: Hazra, Sougata (VerfasserIn)
Weitere Verfasser: Singh, Yashvi (VerfasserIn), Asheghi, Mehdi (VerfasserIn), Goodson, Kenneth (VerfasserIn)
Pages:2020
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2020
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