Analysis on the Package Failure Modes and Condition Monitoring Methods of Wire-Bond IGBT

Analysis on the Package Failure Modes and Condition Monitoring Methods of Wire-Bond IGBT

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Veröffentlicht in:China Electrotechnical Society (16. : 2021 : Peking) The proceedings of the 16th Annual Conference of China Electrotechnical Society ; Volume 3, set 2
1. Verfasser: Liu, Renkuan (VerfasserIn)
Weitere Verfasser: Li, Hui (VerfasserIn), Yao, Ran (VerfasserIn), Wang, Xiao (VerfasserIn), Lai, Wei (VerfasserIn), Tan, Hongtao (VerfasserIn)
Pages:16
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Sprache:eng
Veröffentlicht: 2022
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