| Reliability of BWR Plant Digital Control System
|
1984 |
Okutani, Tetsuro |
| Reliability Evaluation of InGaAsP/InP Buried Heterostructure Lasers
|
1984 |
Todoroki, Satoru |
| Radiation Effect of MOS Device (Total Dose Effect)
|
1984 |
Shibuya, Mikio |
| Utilization of Laser Holography for Reliability Assurance
|
1984 |
Inoue, Masayoshi |
| The Reliability Improvement Activity for Fishing Reels
|
1984 |
Kuromizu, Takashi |
| High Reliability of Flat Package IC from the View of Surface Mounting
|
1984 |
Suzuki, Akira |
| Moisture Induced Failures in Plastic Encapsulated 2 64K Bit Dynamic RAM's
|
1984 |
Satoh, Y. |
| Biometric System of Electronic Component Soldered Joints
|
1984 |
Hara, Kenji |
| Estimation of Breakdown Voltage of High Voltage Rotating Machine ValueS 00000000040 Manufacturing Development Laboratory Mitsubishi Electric Corporation
|
1984 |
Tani, Tsutomu |
| Establishment & Application of Reliability & Quality Standard 4 of Personal Computer (Application of Fraction Defective Control)
|
1984 |
Tamura, Setsurou |
| L-3 Application of R & 0QC Standard to Personal Computer Production PrOCeSS RER ; Reliability Engineering Section, Personal Computer Development Division NEC Corporation
|
1984 |
Tamura, Mitsuo Haraoka, Setsurou |
| Reliability of MF Broadcasting Transmitters (Against Thunder Lightning)
|
1984 |
Haeiwa, Kazuhisa |
| Export Elevator Instrument Transportation and Rust-Proof Countermeasure in Custody-Environments
|
1984 |
Hattori, Katsutoshi |
| Evaluation of Small Power Relay for long Life
|
1984 |
Tatsumi, Kenshi |
| 100-MHz Oscilloscope Reliability Design Based on Field Data Analysis
|
1984 |
Baba, Sueo |
| Reliability Improvement on Attitude Director Indicator
|
1984 |
Tanaka, Hideaki |
| Development of a Structure for DIP-Solderable Mini Plastic IC Packages
|
1984 |
Serizawa, Koji |
| Evaluation Test of Firing Phenomena of Chip Type Solid Tantalum Capacitor
|
1984 |
Enomoto, Hideo |
| Analysis of Market Claims (Forecast of the Incidence Number of Market Claims)
|
1984 |
Fujii, Shigeki |
| Decreasing Soldering Defects During Assembly of Printed Circuit Boards
|
1984 |
Honda, Michiharu |
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