Carrier Profiling of the L0-nm-order Structure in a 3D Flash Memory Cell using Scanning AC, Nonlinear Dielectric Microscopy

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:International Symposium for Testing and Failure Analysis (45. : 2019 : Portland, Or.) ISTFA 2019
1. Verfasser: Hirota, Jun (VerfasserIn)
Weitere Verfasser: Hoshino, Ken (VerfasserIn), Nakar, Tsukasa (VerfasserIn), Yamasue, Kohei (VerfasserIn), Cho, Yasuo (VerfasserIn)
Pages:2019
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2019
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
Modern 2D & 3D X-ray Technologies for Testing and Failure Analysis 2019 Villaraga-Gómez, Herminso
Machine Learning Assisted Signal Analysis in Acoustic Microscopy for Non-Destructive Defect Identification 2019 Kögel, Michael
Solder Bump Joint Failure Investigation: From Sample Preparation to Advanced Structural Characterizations and Strain Measurements 2019 Nowakowski, Pawel
ToF-SIMS, Time-of-Flight Secondary lon Mass Spectroscopy for Counterfeit Detection of Electrical, Electronic, and Electromechanical (EEE) Parts 2019 Simard-Normandin, M.
A Study of Clustering for the Enhancement of Image Resolution in Dynamic Photon Emission 2019 Chef, S.
Automated Multi-level Circuit Net Trace for Hotspot Analysis 2019 Goh, S. H.
Infrared Lock-In Thermography: From Localization of Low Power and Masked Defects to Absolute Temperature Mapping for Product Debug 2019 Jalink, J.
Integrated Diffractive Lenses for Ultrathin Silicon 2019 Veenhuizen, Marc van
Case Study of Electro-Optical Probing Signal with High Signal-Noise Ratio 2019 Xiao, Ryan
Case Studies on Application of Electro Optical Probing (EOP) — A Noninvasive Backside Localization Technique in Failure Analysis 2019 Rajaram, Srinath
A New Approach to IDDQ Failure Fault Localization Using Single Shot Logic (SSL) Patterns 2019 Estores, Rommel
Failure Analysis of FinFET Circuitry at GHz Speeds using Voltage-Contrast and Stroboscopic Techniques on a Scanning Electron Microscope 2019 Vickers, James
Stress Analysis of Damage in Active Circuitry beneath Redistribution Layer (RDL) Bonding Pad and Improvements for Reliability 2019 Shih, Chih-Ching
Nanoprobe Characterization of Soft SRAM Bit Fails in Advanced Technologies 2019 Kodali, Satish
Analysis of Voltage Contrast in Secondary Electron Images Using a High-energy Electron Spectrometer 2019 Asano, Natsuko
Failure Analysis Approaches for Stacking Fault Defects in FinFET Devices 2019 Kim, Beomjun
Residual EG Oxide in FinFET Analyses and Its Impact to Yield, Product Performance, and Transistor Reliability 2019 McGinnis, Pat
Efficient Fault Isolation and Failure Analysis Methods to Root Cause Defects in Microprocessors 2019 Faraby, Hasan
Isolating an Open in 2.5D pBump & Chip Bump Chains using SDR, EBAC and Capacitive Measurements 2019 Distelhurst, Kevin
Conductive-Dissipative-Isolating - Do the Actual Limits in Process Equipment Meet the Requirements of ESD-Sensitive Devices? 2019 Jacob, Peter
Alle Artikel auflisten