Effects of the Sputtering Deposition of Metal Gate Electrode on the Gate Dielectric Characteristics

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (58 : 2000 : Tokio) 58.-Handōtai-Shuseki-Kairo-Gijutsu-Shinpojiumu-kōen-ronbunshū
1. Verfasser: Yamada, T. (VerfasserIn)
Weitere Verfasser: Moriwaki, M. (VerfasserIn), Harada, Y. (VerfasserIn), Eriguchi, K. (VerfasserIn)
Pages:58
Format: UnknownFormat
Sprache:jpn
Veröffentlicht: 2000
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
Effects of the Sputtering Deposition of Metal Gate Electrode on the Gate Dielectric Characteristics 2000 Yamada, T.
Leakage Reduction Mechanism in Crystallized Ta2O5 by Adding WO3 2000 Manabe, K.
Electrical Characteristics of a Tantalum-Pentoxide Capacitor for High-Density DRAMs 2000 Miki, H.
MIM Capacitor Technology Using Low Pressure CVD-WN Storage-Node 2000 Kamiyama, S.
Recent progress and Future Perspective of Low-k Materials 2000 Nakano, T.
Cu CMP Multi-Step Process Performance 2000 Sato, S.
Electrochemical Corrosion of Copper Damascene Interconnection Process 2000 Homma, Y.
Extendibility of Ultrathin Gate Oxide by using Metal Gate Electrode 2000 Nakajima, K.
A Novel Fabrication Technique of Pt Bottom Electrode by Electroplating for Giga bit DRAMs 2000 Horii, H.
BDS(Biased Directional Sputter) for Cu Seed Layer Deposition Process 2000 Sato, M.
Copper Electroplating Technology 2000 Kanki, T.
Zirconium Oxide Based Gate Dielectrics with Equivalent Oxide Thickness of Less than 1.0 nm and Performance of Submicron MOSFET using Nitride Gate Replacement Process 2000 Ueda, T.
Development of Epitaxial Barrier Layers for Ferroelectric Capacito 2000 Sano, K.
Low Temperature Recovery for H2-annealed Ru/(Ba, Sr)TiO3/Ru Thin Film Capacitors 2000 lizuka, T.
A Study on Nucleation and Deposition Reaction Mechanism of Trace Metals on Silicon Wafer Surfaces at Solid/liquid Interface 2000 Homma, T.
Metal Wiring Method using Electroless Plating and Photosensitive Polyimide 2000 Nishikawa, K.
In-situ Observation of Si and Metal Surfaces in CMP Process Employing IR-ATR and RAS 2000 Ogawa, H.
Ultra-Precision Polishing and It’s Applications to the Planalrzation CMP Technology Towards Realization of Cu Wiring/Low-k Interlevel Dielecetrie Layer CMP 2000 Doy, T. Karaki
Effects Oxidation Procedure on the Dielectric Relaxation of the BST Capacitor 2000 Okudaira, T.
Dielectric Thin Film Materials for Advanced Future Devices 2000 Kobayashi, I.
Alle Artikel auflisten