Prospect for Development on 3D-Integration Technology and R & D Result of Functionally Innovative 3D-Integrated Circuit (Dream Chip) Technology in FY2010

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Veröffentlicht in:	Handōtai, Shuseki-Kairo-Gijutsu-75.-Shinpojiumu-kōen-ronbunshū
1. Verfasser:	Kado, M. (VerfasserIn)
Pages:	75
Format:	UnknownFormat
Sprache:	jpn
Veröffentlicht:	2011
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Titel	Jahr	Verfasser
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Opportunities and Challenges of Ge CMOS	2011	Toriumi, A.
Next Generation Energy Systems and Research and Development	2011	Aki, H.
High-Performance Silicon Nanowire Transistors for Utra-Low Power LSI	2011	Saitoh, M.
Low-Power Electronics Project & Association and Denelopment of Low-Voltage Devices	2011	Kimura, S.
History and Future of SPARC64 Processor Development	2011	Maruyama, T.
Prospect for Development on 3D-Integration Technology and R & D Result of Functionally Innovative 3D-Integrated Circuit (Dream Chip) Technology in FY2010	2011	Kado, M.
True Three-Dimensional Through Hole Interconnections	2011	Yamamoto, S.
Activity of Plating for High Density Packaging	2011	Koiwa, I.
Feasibility Study of Plasma Doping and the Application for FinFET	2011	Fuse, G.
Recent Progresses in Development of High Performance Organic Semiconductors for OTFT Applications	2011	Takimiya, K.
Collaboration Between Semiconductors and Biology	2011	Matsumuto, A.
3D LSI Developed by Near-Field Wireless Communication	2011	Kuroda, T.
Three-Dimensional Integration Using Bumpless Through-Silicon-Via and Wafer-on-Wafer Technologies	2011	Ohba, T.
SiC Power Devices	2011	Furukawa, A.
A Novel Cylinder-Type Metal-Insulator-Metal Capacitor in Porous Low-k Film for Embedded DRAM with Advanced CMOS Logics	2011	Hijioka, K.
An Organic Nonvolatile Memory Using Functional Gatr Dielectric	2011	Murata, H.