Reliability of Ultra-Thin Surface Mounted Package ( TQFP)

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Veröffentlicht in:International Symposium on Reliability and Maintainability (20 : 1990 : Tokio) International Symposium on Reliability and Maintainability, 1990-Tokyo
1. Verfasser: OMI, Susumu (VerfasserIn)
Weitere Verfasser: FUJITA, Kazuya (VerfasserIn), TOYOZAWA, Kenji (VerfasserIn), MINAMIDE, Shozo (VerfasserIn), TSUDA, Takaaki (VerfasserIn), MAEDA, T akamichi (VerfasserIn)
Pages:1990-
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 1990
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