IPACK2019-6434 Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

IPACK2019-6434 Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

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Veröffentlicht in:ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019
1. Verfasser: Tayyara, Omri (VerfasserIn)
Weitere Verfasser: Gupta, Kshitij (VerfasserIn), Silva, Carlos Da (VerfasserIn), Nasr, Miad (VerfasserIn), Assadi, Amir (VerfasserIn), Trescases, Olivier (VerfasserIn), Amon, Cristina H. (VerfasserIn)
Pages:2019
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2020
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