| IPACK2019-6334 Optimal Arrangement of Multiple Heat Sources in Vertically Stacked Two-Layer 3-D IC Using Genetic Algorithm
|
2020 |
Rangarajan, Srikanth |
| IPACK2019-6354 Double Side System in Package Development Challenge for Heterogeneous Integration
|
2020 |
Kao, Feng |
| IPACK2019-6507 Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads
|
2020 |
Dale, Travis |
| IPACK2019-6510 Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments
|
2020 |
Singh, Yuvraj |
| IPACK2019-6304 Dynamic Control of Airflow Balance in Data Centers
|
2020 |
Linder, Stephen Paul |
| IPACK2019-6386 Design of Passive Two-Phase Thermosyphons for Server Cooling
|
2020 |
Amalfi, Raffaele L. |
| IPACK2019-6590 Experimental Analysis for Optimization of Thermal Performance of a Server in Single Phase Immersion Cooling
|
2020 |
Shinde, Pravin A. |
| IPACK2019-6600 CFD Analysis of Thermal Shadowing and Optimization of Heatsinks in 3rd Generation Open Compute Server for Single-Phase Immersion Cooling
|
2020 |
Shah, Jimil M. |
| IPACK2019-6602 Computational Form Factor Study of a 3rd Generation Open Compute Server for Single-Phase Immersion Cooling
|
2020 |
Shah, Jimil M. |
| IPACK2019-6541 Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design
|
2020 |
Lee, Chang-Chun |
| IPACK2019-6426 Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature
|
2020 |
Chatterjee, Bikramjit |
| IPACK2019-6384 System Electrothermal Transient Analysis of a High Current (40A) Synchronous Step Down Converter
|
2020 |
Kao,, Rajen Murugan, Jie Chen, Todd Harrison, C. T. |
| IPACK2019-6434 Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger
|
2020 |
Tayyara, Omri |
| IPACK2019-6436 Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules
|
2020 |
Gurpinar, Emre |
| IPACK2019-6442 Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization
|
2020 |
Whitt, Reece |
| IPACK2019-6456 Degradation Modeling and Reliability Assessment of Capacitors
|
2020 |
Gupta, Anunay |
| IPACK2019-6453 Electrothermal Modeling and Analysis of Gallium Oxide Power Switching Devices
|
2020 |
Kotecha, Ramchandra M. |
| IPACK2019-6499 Quantitative Characterization of Sapphire and Silicon Nitride for Space Applications Circuit Subassemblies Using Cryogenic Cycling
|
2020 |
Lovelace, Kirsten |
| IPACK2019-6519 A Numerical Investigation of Additive Manufactured Foam Structures for Single Phase Hotspot Thermal Management
|
2020 |
Broughton, Justin |
| IPACK2019-6534 Thermal Analysis of High Efficiency High Speed Drives
|
2020 |
Khakpour, Yasmin |
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