IPACK2019-6354 Double Side System in Package Development Challenge for Heterogeneous Integration

IPACK2019-6354 Double Side System in Package Development Challenge for Heterogeneous Integration

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Veröffentlicht in:ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019
1. Verfasser: Kao, Feng (VerfasserIn)
Weitere Verfasser: Wang, Yu-Po (VerfasserIn), Wang, Davidlion (VerfasserIn), Tsai, Jensen (VerfasserIn), Tsai, Mike (VerfasserIn), Chiu, Ryan (VerfasserIn), He, Eric (VerfasserIn)
Pages:2019
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2020
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