Characterization of Wetting of Deep Silica Nanoholes by Aqueous Solutions Using ATR-FTIR

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	International Symposium on Ultra Clean Processing of Semiconductor Surfaces (15. : 2021 : Mecheln) Ultra clean processing of semiconductor surfaces XV
1. Verfasser:	Vereecke, G. (VerfasserIn)
Weitere Verfasser:	Darcos, A. (VerfasserIn), Iino, H. (VerfasserIn), Holsteyns, F. (VerfasserIn), Sánchez, E. A. (VerfasserIn)
Format:	UnknownFormat
Sprache:	eng
Veröffentlicht:	2021
Schlagworte:
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Bestellen

Titel	Jahr	Verfasser
Cl-Containing Microplastics from the Environment	2021	Knotter, D. M.
Experimental Wafer Carrier Contamination Analysis and Monitoring in Fully Automated 300 mm Power Production Lines	2021	Zängle, C.
Wet Chemical Cleaning of Organosilane Monolayers	2021	Hinckley, A. P.
Si1-XGeX Selective Etchant for Gate-All-Around Transistors	2021	Harada, K.
GaN MOS Structures with Low Interface Trap Density (Invited)	2021	Chu, R. M.
Formulation and Evaluation of Diluted Sulfuric-Peroxide-HF (DSP+) Mixtures for Cleaning High-Aspect Ratio Contacts in 3D NAND	2021	An, K. H.
Breakthrough of Sublimation Drying by Liquid Phase Deposition	2021	Sasaki, Y.
New Test Structure Development for Pattern Collapse Evaluations	2021	Xu, X. M.
Estimation of the Generation Rate of H· Radicals in a Megasonic Field Using an Electrochemical Technique	2021	Han, Z. X.
Ultrafine Particle Removal in the Wafer Cleaning Process Using an Aqueous Solution with a High Concentration of Dissolved O3 and HF	2021	Han, H. J.
Scalable Particle Removal for sub-5 nm Nodes	2021	Yoshida, Y.
Tribological Characterization of Anionic Supramolecular Assemblies in Post-STI-CMP Cleaning Solution Using a Novel Post-CMP PVA Brush Scrubber	2021	Philipossian, A.
Removal of Post Etch Residue on BEOL Low-K with Nanolift	2021	Akanishi, Y.
Selective Nickel Platinum Removal without Titanium Nitride Metal Gate Corrosion	2021	Garnier, P.
Selective Ru or Co Etch for 3nm Applications	2021	Hsu, C. P. S.
Remote Plasma Etching of Backend Semiconductor Materials for Reliable Packaging	2021	Evertsen, R.
Direct Analysis of Ultra Trace Metallic Particles in NH3 and HCl Gases by Gas Exchange Device (GED)-ICP-MS	2021	Kawabata, K.
Towards Si-Cap-Free SiGe Passivation: Impact of Surface Preparation on Low-Pressure Oxidation of SiGe	2021	Wostyn, K.
Surface Chemistry and Nanoscale Wet Etching of Group IV Semiconductors in Acidic H2O2 Solutions	2021	Dorp, D. H. van
Highly Selective Etching between Different Oxide Films by Vapor Phase Cleaning	2021	Nishihara, K.

Alle Artikel auflisten