Wafer Bonding in MEMS Technologies

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Bibliographische Detailangaben
Veröffentlicht in:	MAMM (5. : 2020 : Ilmenau) Microactuators, microsensors and micromechanisms
1. Verfasser:	Knechtel, Roy (VerfasserIn)
Weitere Verfasser:	Schwarz, Uwe (VerfasserIn)
Format:	UnknownFormat
Sprache:	eng
Veröffentlicht:	2021
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Titel	Jahr	Verfasser
Parameter study of compliant elements for a bipedal robot to increase its walking efficiency	2021	Zirkel, Marten
Modelling and investigation of a compliant cable-driven finger-like mechanism	2021	Uhlig, René
A novel planar two-axis leaf-type notch flexure hinge with coincident rotation axes and its application to micropositioning stages	2021	Linß, Sebastian
Reconfigurable planar quadrilateral linkages based on the tensegrity principle	2021	Schorr, Philipp
Synthesis of Micro-robotic Appendages Considering Different Performance Properties	2021	Milojević, Andrija
Topology optimization of magnetoelectric sensors using Euler-Bernoulli beam theory	2021	Krey, Maximilian
Conceptual design of a microscale balance based on force compensation	2021	Wedrich, Karin
Modeling, design and prototyping of a pantograph-based compliant mechanism	2021	Stojiljković, Dušan
Optimization of compliant path-generating mechanisms based on non-linear analytical modeling	2021	Henning, Stefan
Characterization of thin flexure hinges for precision applications based on first eigenfrequency	2021	Darnieder, Maximilian
MEMS Acoustical Actuators: Principles, Challenges and Perspectives	2021	Fritsch, Tobias
Wafer Bonding in MEMS Technologies	2021	Knechtel, Roy