| Optical Micro Sensors Integration and Application
|
2014 |
Morita, Nobutomo |
| Highly Moisture Resistant IGZO Films with a Barrier Layer for Flexible Transparent Conductive Substrates
|
2014 |
Nagamoto, Koichi |
| Power Efficient Data Rate for Photonic Interposer
|
2014 |
Chujo, Norio |
| Positive-Tone Photodefinable Polyimide For Low Temperature Cure
|
2014 |
Matsukawa, Daisaku |
| Direct Core Monitoring Technique for Passive Optical Alignment between Multichannel Silicon Waveguide and Single-Mode Fiber Array
|
2014 |
Maruyama, Kazunori |
| Novel exposure system for FOWLP and MCM photolithography process
|
2014 |
Nagao, Kiyoshi Kitamura, Kazuhiro Nakai, Hiroshi Matsui, Tatsuya |
| High Aspect Ratio TSV Etching Process for High-capacitor
|
2014 |
Murayama, Takahide |
| Organic-Inorganic Hybrid Materials for Wavelength Division Multiplexing Filter in Self-Written Waveguide Module
|
2014 |
Sugihara, Okihiro |
| High-Speed Optical Beam Scanning Using KTN Crystal
|
2014 |
Sakamoto, Takashi |
| Stretchable and deformable Electronic Systems in thermoplastic Matrix Materials
|
2014 |
Löher, Thomas |
| Highly Heat-resistant Bio-based Nanofiber Substrate for Flexible Electronics
|
2014 |
Hsieh, Ming-chun |
| Low Power Penalty, Dry-Film Polymer Waveguides for Silicon Photonics Chip Packaging
|
2014 |
Hsu, Hsiang-Han |
| Silica Nanowires as New Coating Material for High-efficiency Light Reflection in LED System
|
2014 |
Xi, Shuang |
| High Speed LCP Board for 28Gbps Transmission through 300mm
|
2014 |
Kataoka, Ryohei |
| Simulation of Differential Skew Considering Fiber Kink Effects
|
2014 |
Fukumori, Taiga |
| Precision Assembly of Polymer Waveguide Components for Silicon Photonic Packaging
|
2014 |
Taira, Yoichi |
| Electro-migration Behavior in Fine Pitch SnBi Eutectic Solder Bump Interconnections
|
2014 |
Murayama, Kei |
| Measurement and Modeling for MOS Reverse Current of Switching DC/DC Converter
|
2014 |
Masuyama, Masahiro Terasaki, Yuta Oohashi, You |
| Analysis of Novel Technology for Power and Signal Integrity using a Metal Particle Conductive Layer
|
2014 |
Sasaoka, Norifumi |
| A Compact 25-Gbit/s x 4ch Optical Interconnect Module with Straddle-shaped Optical and Electrical Interface
|
2014 |
Matsuoka, Yasunobu |
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