| Optical Micro Sensors Integration and Application
|
2014 |
Morita, Nobutomo |
| Highly Moisture Resistant IGZO Films with a Barrier Layer for Flexible Transparent Conductive Substrates
|
2014 |
Nagamoto, Koichi |
| Power Efficient Data Rate for Photonic Interposer
|
2014 |
Chujo, Norio |
| Positive-Tone Photodefinable Polyimide For Low Temperature Cure
|
2014 |
Matsukawa, Daisaku |
| Direct Core Monitoring Technique for Passive Optical Alignment between Multichannel Silicon Waveguide and Single-Mode Fiber Array
|
2014 |
Maruyama, Kazunori |
| Novel exposure system for FOWLP and MCM photolithography process
|
2014 |
Nagao, Kiyoshi Kitamura, Kazuhiro Nakai, Hiroshi Matsui, Tatsuya |
| High Aspect Ratio TSV Etching Process for High-capacitor
|
2014 |
Murayama, Takahide |
| Organic-Inorganic Hybrid Materials for Wavelength Division Multiplexing Filter in Self-Written Waveguide Module
|
2014 |
Sugihara, Okihiro |
| High-Speed Optical Beam Scanning Using KTN Crystal
|
2014 |
Sakamoto, Takashi |
| Stretchable and deformable Electronic Systems in thermoplastic Matrix Materials
|
2014 |
Löher, Thomas |
| Highly Heat-resistant Bio-based Nanofiber Substrate for Flexible Electronics
|
2014 |
Hsieh, Ming-chun |
| Evaluation of Thermal Interface Material with Electric Capacitance Measurement: A new method using metal meshes to present finer surface roughness levels
|
2014 |
Saito, Yasuhiro |
| Lifetime Evaluation of Ultra-thin Polymer Pulsating Heat Pipe
|
2014 |
Ogata, Susumu |
| Phase Stability Analysis of Swept Light Source with KTa1-xNbxO3 Electro-Optic Deflector toward Doppler Optical Coherence Tomography
|
2014 |
Hasegawa, Shinya |
| A Study on Differential Mode to Common Mode Conversion due to Asymmetric Structure in Differential Transmission Line
|
2014 |
MOTOHASHI, Ayumi |
| Soldering Material for Fine PoP (Package on Package)
|
2014 |
Hashimoto, Yutaka |
| (Invited) Power-bus Noise Reduction Using Ferrite-covered Open Stub in Printed Circuit Board
|
2014 |
Toyota, Yoshitaka |
| IO INTERFACE FOR OVER 25GBPS OPERATION WITH LOW POWER
|
2014 |
Otsuka, Kanji |
| Assembly process for high bandwidth density organic optical MCM
|
2014 |
Tokunari, Masao |
| Improvement of Power Integrity with Thin Film Capacitors Embedded in Organic Interposer
|
2014 |
Yoshizawa, Masamitsu |
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