| Optical Micro Sensors Integration and Application
|
2014 |
Morita, Nobutomo |
| Highly Moisture Resistant IGZO Films with a Barrier Layer for Flexible Transparent Conductive Substrates
|
2014 |
Nagamoto, Koichi |
| Power Efficient Data Rate for Photonic Interposer
|
2014 |
Chujo, Norio |
| Positive-Tone Photodefinable Polyimide For Low Temperature Cure
|
2014 |
Matsukawa, Daisaku |
| Direct Core Monitoring Technique for Passive Optical Alignment between Multichannel Silicon Waveguide and Single-Mode Fiber Array
|
2014 |
Maruyama, Kazunori |
| Novel exposure system for FOWLP and MCM photolithography process
|
2014 |
Nagao, Kiyoshi Kitamura, Kazuhiro Nakai, Hiroshi Matsui, Tatsuya |
| High Aspect Ratio TSV Etching Process for High-capacitor
|
2014 |
Murayama, Takahide |
| Organic-Inorganic Hybrid Materials for Wavelength Division Multiplexing Filter in Self-Written Waveguide Module
|
2014 |
Sugihara, Okihiro |
| High-Speed Optical Beam Scanning Using KTN Crystal
|
2014 |
Sakamoto, Takashi |
| Stretchable and deformable Electronic Systems in thermoplastic Matrix Materials
|
2014 |
Löher, Thomas |
| Highly Heat-resistant Bio-based Nanofiber Substrate for Flexible Electronics
|
2014 |
Hsieh, Ming-chun |
| Miniaturized LTE Modem SiP Using Novel Multiple Compartments Shielding
|
2014 |
Leou, JL |
| (Invited) Over-1000-channel Hybrid Integrated Light Source with Laser Diode Arrays on a Silicon Waveguide Platform for Ultra-high-bandwidth Optical Interconnections
|
2014 |
Shimizu, Takanori |
| Development of Combined Surface Activated Bonding (SAB) Method for Hydrophilic Wafer Bonding
|
2014 |
He, Ran |
| On-board Snubber Circuit for Damping of Anti-resonance Peak in Total PDN
|
2014 |
Yamaguchi, Toma |
| Loss Analysis for Optical MCM Based Optical Link
|
2014 |
Hsu, Hsiang-Han |
| 3.3-Tb/s compact optical fiber package using pre-formed optical fiber
|
2014 |
Nomura, Rika |
| Photosensitive Insulation Coating for a Copper Redistribution Layer Process
|
2014 |
Matsutani, Hiroshi |
| A Feasibility Study of Novel Packaging Technology for Low Cost and High Performance Systems .
|
2014 |
Iguchi, Daisuke |
| 1060-nm VCSEL-based 28-Gb/s x 4-channnel optical signal transmission beyond 500-m MMF using high-density parallel-optical modules
|
2014 |
Ishikawa, Kazuya Nagashima, Tomofumi Kise, Yozo |
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