Nanotechnology for electronics, photonics, biosensors, and emerging technologies = Annual Symposium Connecticut Microelectronics Optoelectronics Consortium CMOC 28th
Intro -- Contents -- Preface -- Novel POC Bionanosensor for Direct Detection of RNA-Virus Infections in Minutes -- References -- Ultra-Sensitive Point of Care Biosensor for Detecting Pathogeneses -- Results -- Conclusions -- References -- Thin Film Deposition and Carbon Nanotube Synthesis -- 1. Intr...
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| Format: | UnknownFormat |
| Sprache: | eng |
| Veröffentlicht: |
New Jersey, London, Singapore, Beijing, Shanghai, Hong Kong, Taipei, ChennaipTokyo
World Scientific
2020
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| Schriftenreihe: | Selected topics in electronics and systems
vol. 64 |
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| Online Zugang: | Inhaltsverzeichnis |
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Tag hinzufügen | Zusammenfassung: | Intro -- Contents -- Preface -- Novel POC Bionanosensor for Direct Detection of RNA-Virus Infections in Minutes -- References -- Ultra-Sensitive Point of Care Biosensor for Detecting Pathogeneses -- Results -- Conclusions -- References -- Thin Film Deposition and Carbon Nanotube Synthesis -- 1. Introduction -- 2. Methodology -- 2.1. Thin film -- 2.2. Carbon nanotubes -- 2.3. Scanning electron microscope -- 3. Results -- 3.1. Thin film -- 3.2. Nanoparticles -- 3.3. Density -- 3.4. Carbon Nanotubes -- 4. Conclusion -- 4.1. Thin Film Deposition and Thickness -- 4.2. Nanoparticles 4.3. Carbon Nanotubes -- 5. Summary/Future Work -- 5.1. Summary -- 5.2. Future Work -- Acknowledgements -- Appendix A. TPVD Trials -- Appendix B. CVD Trials -- Appendix C. Pressure Gauge Conversion Table -- Appendix D. Outliers -- References -- Inkjet-/3D-/4D-Printed Wireless Ultrabroadband Modules for IoT, Smartag and Smart City Applications -- 1. Introduction -- 2. On the Device Scale: The Internet of Skins and Origami based RF Structures -- 3. On the Package Scale: On-Package Antennas -- 4. On the Die Scale: 3D/Inkjet Printed Interconnects 5. On the Component Scale: Fully printed sensors and passive components -- 6. Future Works and Conclusion -- Acknowledgements -- References -- Threading Dislocation Behavior in InGaAs/GaAs (001) Superlattice Buffer Layers -- 1. Introduction -- 2. Plastic Flow Model (DTKA Model) -- 3. Results and Discussion -- 4. Conclusion -- References -- Integration of Quantum Dot Gate (QDG) in SWS-FETs for Multi-Bit Logic and QD-NVRAMs for Distributed In-Memory Computing -- 1. Introduction to 2-Bit Logic using SWS-FET -- 2. Fast-erase low-voltage QD-NVRAMs 3. Enhanced number of bits in a 2-channel SWS-FET configured as QD-NVRAM and as a multi-state QDG-FET for Logic -- 4. Multipliers and Adders using quaternary SWS-FETs -- 5. In-Memory digital and analog computing -- 6. Conclusion -- Acknowledgments -- References -- Blockchain and the Emerging Trends for Improving "Smart Contract" Security -- 1. Introduction -- 2. Blockchain Architecture -- 3. Blockchain Integrity through Consensus and the 51% attack -- 4. Solutions to mitigate the 51% Attack -- 4.1. Proof of Stake (POS) Consensus Methods -- 4.2. Permissioned vs. Permission-less Blockchain 4.3. Private Transaction Implementation for Parity Ethereum, and Quorum implementations -- 4.4. Second Factor Authentication (2FA) for Smart Contract -- 5. Conclusion -- References -- Comparative Study on in-situ Ellipsometric Monitoring of III-Nitride Film Growth via Plasma-Enhanced Atomic Layer Deposition -- 1. Introduction -- 2. Experimental and Characterization -- 3. Results -- 4. Conclusion -- References -- Transformable Electronics Implantation in ROM for Anti-Reverse Engineering -- 1. Introduction -- 2. Transformable Electronics Implantation in ROM -- 3. Design Methodology |
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| Beschreibung: | Literaturangaben "...the 28th Annual Symposium of the Connecticut Microelectronics and Optoelectronics Consortium (CMOC), held on March 27, 2019 at The University of New Haven (Orange Connecticut Campus)." - Vorwort |
| Beschreibung: | vii, 142 Seiten Illustrationen, Diagramme |
| ISBN: | 9789811227240 978-981-12-2724-0 981122725X 981-12-2725-X 9811227241 981-12-2724-1 |