Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2

Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2

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Bibliographische Detailangaben
Körperschaften: ECS Meeting (VerfasserIn), Electrochemical Society (Herausgebendes Organ), Electrochemical Society Electronics and Photonics Division (SponsorIn), Electrochemical Society Dielectric Science and Technology Division (SponsorIn), Electrochemical Society Electrodeposition Division (SponsorIn)
Weitere Verfasser: Dow, W.-P. (HerausgeberIn)
Format: UnknownFormat
Sprache:eng
Veröffentlicht: Pennington, NJ, USA ECS, the Electrochemical Society 2019
Red Hook, NY Curran Associates, Inc.
Schriftenreihe:ECS transactions Electronic materials and processing vol. 92, no. 5
Schlagworte:
Konferenzschrift
Online Zugang:Inhaltsverzeichnis
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Beschreibung
Beschreibung:"From Oct. 13-17, 2019 the International Symposium on Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2 has been held as part of the 236th Meeting of the Electrochemical Society. The venue was Atlanta, Georgia" - Vorwort
Literaturangaben
Beschreibung:v, 47 Seiten
Illustrationen
ISBN:9781510895911
978-1-5108-9591-1