Processing, materials, and integration of damascene and 3D interconnects : [Symposium "Processing, Materials, and Integration of Damascene and 3D Interconnects", held during the 218th meeting of the Electrochemical Society, in Las Vegas, Nevada from October 10 to 15, 2010]

Processing, materials, and integration of damascene and 3D interconnects [Symposium "Processing, Materials, and Integration of Damascene and 3D Interconnects", held during the 218th meeting of the Electrochemical Society, in Las Vegas, Nevada from October 10 to 15, 2010]

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Bibliographische Detailangaben
Körperschaften: Electrochemical Society Electronics and Photonics Division (BerichterstatterIn), Electrochemical Society Dielectric Science and Technology Division (BerichterstatterIn)
Weitere Verfasser: Flake, J. (BerichterstatterIn)
Format: UnknownFormat
Sprache:eng
Veröffentlicht: Pennington, NJ ECS 2010
Schriftenreihe:ECS transactions Dielectric and semiconductor materials, devices, and processing 33,12
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