Semiconductor packaging materials interaction and reliability

"Preface Semiconductor packaging assembly and test is an important manufacturing step necessary to create electronic products. The subject is not understood in much depth, as compared to a subject like circuit design. It is generally believed that this is due to the nature of the topic, as back...

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Bibliographische Detailangaben
1. Verfasser: Chen, Andrea (VerfasserIn)
Weitere Verfasser: Lo, Randy Hsiao-Yu (VerfasserIn)
Format: UnknownFormat
Sprache:eng
Veröffentlicht: Boca Raton, Fla. u.a. CRC Press c 2012
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