Semiconductor packaging materials interaction and reliability
"Preface Semiconductor packaging assembly and test is an important manufacturing step necessary to create electronic products. The subject is not understood in much depth, as compared to a subject like circuit design. It is generally believed that this is due to the nature of the topic, as back...
Gespeichert in:
1. Verfasser: | |
---|---|
Weitere Verfasser: | |
Format: | UnknownFormat |
Sprache: | eng |
Veröffentlicht: |
Boca Raton, Fla. u.a.
CRC Press
c 2012
|
Schlagworte: | |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Keine Ergebnisse!