The First Asia-Pacific Conference on Materials and Processes in IC Encapsulation March 18 - 19, 1996, ITRI International Conference Center, Hsinchu, Taiwan [Hauptbd.] [Proceedings]

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Bibliographische Detailangaben
Körperschaften:	Asia Pacific Conference on Materials and Processes in IC Encapsulation (VerfasserIn), Taiwan Department of Industrial Technology (BerichterstatterIn), Gongye-Cailiao-Yanjiusuo (BerichterstatterIn)
Weitere Verfasser:	Lee, Li-Chung (BerichterstatterIn)
Format:	UnknownFormat
Sprache:	eng
Veröffentlicht:	Hsinchu, Taiwan ITRI MRL 1996
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Titel	Jahr	Band
The First Asia-Pacific Conference on Materials and Processes in IC Encapsulation : March 18 - 19, 1996, ITRI International Conference Center, Hsinchu, Taiwan Workshop on Plastic Packaging : [assembly, reliability and challenges] / [Lecturer:] Luu T. Nguyen	1996
The First Asia-Pacific Conference on Materials and Processes in IC Encapsulation : March 18 - 19, 1996, ITRI International Conference Center, Hsinchu, Taiwan [Hauptbd.] [Proceedings]	1996	[Hauptbd.]