LTS 572: Solder Ball Drift Behavior of Hybrid SnAgCu-LTS Solder Interconnects in Accelerated Thermal Cycling

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Veröffentlicht in:SMTA International Conference (2021 : Minneapolis, Minn.; Online) 2021 SMTA International Conference ; Volume 2 of 2
1. Verfasser: Wentlent, Luke (VerfasserIn)
Weitere Verfasser: Wilcox, James (VerfasserIn), Meilunas, Michael (VerfasserIn)
Pages:2021
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2022
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