48th International Symposium for Testing and Failure Analysis (ISTFA 2022) Pasadena, California, USA, 30 October-3 November 2022 Volume 1 of 2

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Körperschaften: International Symposium for Testing and Failure Analysis (VerfasserIn), Electronic Device Failure Analysis Society (VeranstalterIn), ASM International (VeranstalterIn)
Format: UnknownFormat
Sprache:eng
Veröffentlicht: Red Hook, NY Curran Associates, Inc. 2023
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Konferenzschrift
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Titel Jahr Verfasser
1D-ResNet Framework for Ultrasound Signal Classification 2023 Nair, Arya Sukumaran
Machine Learning Reinforced Acoustic Signal Analysis for Enhancing Non-Destructive Defect Localization and Reliable Identification 2023 Brand, Sebastian
A Quick and Intuitive Approach of Handeling In-Amp Failures Towards Lower Cycle Time and Improving Failure Mechanism Confidence and Quality 2023 Cajucom, Khristopherson
Enhanced CAD Alignment Technique for FinFET Devices 2023 Gopinath, Ranganathan
Investigation of Thermal Laser Stimulation (TLS) Effects on 7nm FinFET Transistor Parameters 2023 Oarethu, Johns
Investigation of the Growth Mechanics of Laser Assisted Copper Deposition for Circuit Edit Applications 2023 DiBattista, Michael
Differential Laser Voltage Probe—A New Approach to a Fundamental Technique 2023 Dickson, Kristofor
Comparing Behaviors of FIB Toolsets in a Large Scale Automated XTEM Sample Preparation Setup 2023 Dixit, Vikas
Develop a Time Efficient Method to Enhance the FIB Process on Die Backside Metallization (BSM) Analysis 2023 Wee, Lo Chea
Overcoming Challenging Failure Analysis Sample Types on a Single IR/Raman Platform! 2023 Anderson, Jay
High-Resolution Conductivity Mapping with STEM EBIC 2023 Hubbard, William A.
Zero Channel Bias Determination of Device Turn-On and the Seebeck Effect in Nanoprobing 2023 Johnson, Gregory M.
A Multi-Protocol Module To Provide An External Trigger For Dynamic Lock-In Thermography 2023 Bienek, Ray
The Impact of Ambient Humidity on the Surface Conductance of SiNx Films for Application in Capacitive MEMS Switches 2023 Birmpiliotis, Dimitris
Studies and Applications of A New Delineation Method of Silicon Defects in Wafer Fabrication 2023 Hua, Younan
Complementary Fault Isolation Procedures Combining Laser Voltage Probing/Imaging and Lock-In Thermography—Case Studies 2023 Lee, Sukho
Decapsulating Small Outline Transistor (SOT) Packaged Devices using Acrylic Molding Technique 2023 Saputil, John Michael
Die Level Traceability as an Essential Tool in Failure Analysis and the Road to Zero Defects 2023 Carlo, Jon
Newly Designed, Faster, and More Sensitive Scanning Capacitance Microscope for Failure Analysis 2023 Zhang, Haigang
Machine Learning Methods for FEOL/MEOL Defects Measurement through SRAM Bitmap 2023 Zou, Ningmu Nathan
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