DETC2020-22125 Monitoring Method for Laser Via Hole Processing of Printed Circuit Boards Based on Two-Color Method With a High-Speed Video Camera

DETC2020-22125 Monitoring Method for Laser Via Hole Processing of Printed Circuit Boards Based on Two-Color Method With a High-Speed Video Camera

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Veröffentlicht in:ASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference (2020 : Online) Proceedings of the ASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference - 2020 ; Volume 6: 25th Design for Manufacturing and the Life Cycle Conference (DFMLC 2020)
1. Verfasser: Nakagawa, Wataru (VerfasserIn)
Weitere Verfasser: Yamaguchi, Ryuta (VerfasserIn), Hirogaki, Toshiki (VerfasserIn), Aoyama, Eiichi (VerfasserIn)
Pages:2020
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2020
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