Use of Flash Lamps to Achieve Non-equilibrium Soldering and Assembly Utilizing Conventional SAC Alloys

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:SMTA International Conference (2020 : Online) SMTA International Conference 2020
1. Verfasser: Akhavan, Vahid (VerfasserIn)
Pages:2020
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2021
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
Design for Sustained High Temperature Operation of FCBGAs Based on Process-Performance Relationships 2021 Lall, Pradeep
Metallic Corrosion Potential during the Cleaning Process 2021 Lober, David
Plasma Treatment Study of Copper Heatsink for Improved Adhesion of Thermally Conductive Adhesive 2021 Patra, Swagatika
Updates on the Industry Standards for SMT Moisture/Reflow Sensitive Devices 2021 Bora, Mumtaz
Process Control Plan to Monitor Acceptable Levels of Flux and Other Residues 2021 Capen, Bill
Intermetallic Compounds Growth Analysis with two methods: X-Ray Diffraction compared to the combination of X-Ray Fluorescence (XRF) and Coulometric Stripping (CS) 2021 Servin, Jose
Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony 2021 Coyle, Richard
Effect of Initial Volume Ratio and Reflow Temperature on the Microstructure of SnBiAg-SAC Mixed Solder Joints 2021 Cotts, Eric
Measurement of Change in CTEof PCBs Due to Single Phase Immersion Cooling and Impact of Changed Properties of PCBs on Solder Joint Reliability of BGA Package 2021 Dhandarphale, Sameer
Thermal Reliability of Mixing Bismuth-containing Solder Paste with SAC BGAs at Low Reflow Temperatures - Part 1 2021 Anselm, Martin
Contact Interconnect Challenges and Resolution-Part 2: Cable and Connector Contact interconnect Integrity in Enterprise Server fir DC Application 2021 Wang, Paul
Low Melting Solder Affects Selective Soldering Settings and Materials 2021 Diepstraten, Gerjan
X-Ray Technology for Demanding Applications 2021 Bryant, Keith
Deposit Properties of Electroless Au/Pd/Au Process for 5G Application 2021 Sasamura, Tetsuya
ENIG - Corrosion: When It Gets Critical and How Is the Status in the PCB Industry? 2021 Schafsteller, Britta
Automatic Reflow Profiling and Data Analytics 2021 Pfluke, Karl
3D Integration using Heterogeneous System-in-Package (HSIP) Technology 2021 Woychik, Charles
Cu Paste for Molded Interconnect Devices 2021 Ejiri, Yoshinori
Process Development Challenges For Heatsink Assembly Using Thermally Conductive Adhesive 2021 Rout, Raghabendra
Designing a Cleanliness Risk Profile on Leadless & Near Chip Scale Packages 2021 Bixenman, Mike
Alle Artikel auflisten