Microstructural Evolution in Au-containing SnPb and SAC305 Joints During Thermal Cycling of Lead-Less Chip Carriers

Microstructural Evolution in Au-containing SnPb and SAC305 Joints During Thermal Cycling of Lead-Less Chip Carriers

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Veröffentlicht in:SMTA International Conference (2020 : Online) SMTA International Conference 2020
1. Verfasser: Yaeger, Alyssa (VerfasserIn)
Pages:2020
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2021
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