Nickel-Free Surface Finish Solution FOR 5G, RF, Microwave, High-Frequency-HDI PCB Applications-Relibility in Focus

Nickel-Free Surface Finish Solution FOR 5G, RF, Microwave, High-Frequency-HDI PCB Applications-Relibility in Focus

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:SMTA International Conference (2020 : Online) SMTA International Conference 2020
1. Verfasser: Shah, Kunal (VerfasserIn)
Pages:2020
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2021
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
3D Integration using Heterogeneous System-in-Package (HSIP) Technology 2021 Woychik, Charles
Cu Paste for Molded Interconnect Devices 2021 Ejiri, Yoshinori
Process Development Challenges For Heatsink Assembly Using Thermally Conductive Adhesive 2021 Rout, Raghabendra
Designing a Cleanliness Risk Profile on Leadless & Near Chip Scale Packages 2021 Bixenman, Mike
Fine Powder Investigation for Optimum Imperial 008004 Solder Paste Printing - Part 1 2021 Murling, Adam
A Comparative Study of Mitigation Methods and Effect of Temperature on Sulfur Corrosion of 0201 Resistors 2021 Rout, Raghabendra
Material Behavior of Aged SAC Solder Alloys under Sustained Operation at Extreme Cold Temperatures at High-Strain Rates 2021 Lall, Pradeep
Behaviour and Strengthening Effects of Sb in a Low-Bi Sn-Cu Solder Alloy 2021 Sweatman, Keith
Effect of New SAC-Bi Solder Pastes on Thermal Cycling Reliability Considering Aging 2021 Belhadi, Mohammed
Effect of Current Stress on the Microstructure Evolution of SnBiAg-SAC Mixed Solder Joints 2021 Hadian, Faramarz
Intermetallic Compound Growth and Gold Embrittlement Effect in Sn-Bi Low Temperature Solders in Contact with Electroless Nickel Emersion Gold (ENIG) Surface Finish 2021 Fan, Yaohui
Microstructure Evaluation and Ball Shear Testing of SAC- Bi Pb-Free Solder Alloys 2021 Rosas, Julian
Reliability Behavior of Surface Mount Devices Assembled with Bismuth Bearing Low-Melt Solder Pastes 2021 Wentlent, Luke
EMS Process Capability Qualification & Monitoring for Complex Aerospace & Defense PCBA: A Successful Implementation in India 2021 Sundareshan, Sriranjani
How The New IPC Digital Twin Standard Impacts Manufacturing 2021 Ford, Michael
Your Risk of Counterfeit Products - Sales and Supply Chains 2021 Coates, Rosemary
Use of Flash Lamps to Achieve Non-equilibrium Soldering and Assembly Utilizing Conventional SAC Alloys 2021 Akhavan, Vahid
Single Step Metallization Process for the Filling of Through Holes with Copper 2021 Gugliotti, Carmichael
PCB Embedding Technology for 5G MIMO Antenna Modules 2021 Boettcher, Lars
LFF BGA SMT and Rework Learnings 2021 Shah, Hemant
Alle Artikel auflisten