IPACK2020-2528 Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

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Bibliographische Detailangaben
Veröffentlicht in:	ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020
1. Verfasser:	Hung, Chu-Pao (Otis) (VerfasserIn)
Weitere Verfasser:	Wang, Yu-Po (VerfasserIn), Chen, Steven (VerfasserIn), Wan, Katch (VerfasserIn)
Pages:	2020
Format:	UnknownFormat
Sprache:	eng
Veröffentlicht:	2020
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