IPACK2020-2678 Reliability Assessment of Cu-Al WB Under High Temperature and High Voltage Bias Application

IPACK2020-2678 Reliability Assessment of Cu-Al WB Under High Temperature and High Voltage Bias Application

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Veröffentlicht in:ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020
1. Verfasser: Lall, Pradeep (VerfasserIn)
Weitere Verfasser: Jung, Sungmo (VerfasserIn)
Pages:2020
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2020
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