Enhanced Forced Convection Cooling of Power Electronics Devices Exposed to Hot Climatıc Conditions by Copper Metal Foam

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Veröffentlicht in:Techno-Societal (Veranstaltung : 2. : 2018 : Maharashtra) Techno-Societal 2018 ; volume 2
1. Verfasser: Borakhade, Kishor (VerfasserIn)
Weitere Verfasser: Mahalle, Ashish (VerfasserIn)
Pages:2018
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2020
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