| Peristaltic MicroPump with Active Damping (PMP-AD)
|
2019 |
Spieth, Sven |
| Waferbonding Technologies for 3D-Integration
|
2019 |
Baum, Mario |
| Integration concepts for fluidic actuators in hybrid structures
|
2019 |
Schüller, Martin |
| Manufacturing of 3D Mechatronic Systems with Plasma Technology
|
2019 |
Schramm, René |
| Interflex: challenges and solutions to fabricate a double-sided wiring layer for a "system in foil"
|
2019 |
Yacoub-George, Erwin |
| Viable Engineered Substrate enabled simple and robust built-in thin film encapsulation on SOI MEMS resonators
|
2019 |
Guo, Bin |
| Tactile Sensor Network System with CMOS-MEMS Integration for Social Robot Applications
|
2019 |
Muroyama, Masanori |
| 3D Module mixing bare dies and packaged components
|
2019 |
Morel, Paul-Henry |
| LTCC packages optimized for use with SAW and FBAR sensors in environmental parameters monitoring
|
2019 |
Buiculescu, Valentin |
| Fully integration of an innovative pressure sensor platform
|
2019 |
Herrán, J. |
| Xtrinsic Intelligent Sensing Framework - A New Era in Sensor Data Processing
|
2019 |
Nadworny, Margaret |
| Approaches for System Reliability in Consideration of Application Oriented Loads as well as Physics-Of-Failure
|
2019 |
Straube, Stefan |
| Increasing the lifetime of wire bond interconnections for power applications by the use of aluminium cladded copper wire
|
2019 |
Fella, Frank |
| Pitfalls by applying pulsed EMC & ESD System Level Stress Requirements to On-Chip Protection Design by Automotive Examples
|
2019 |
Mayerhofer, Michael |
| Automatic Behavioural Model Generation Opens New Perspectives in the Design of Smart Systems
|
2019 |
Gillon, Renaud |
| MOEMS Virtual Prototype Platform
|
2019 |
Guarnera, Mirko |
| Rapid detection of bacteria by low-cost microfluidic system
|
2019 |
Puchberger-Enengl, Dietmar |
| Roll-to-Roll Hot Embossing of Micron and Nanoscale Structures for the Fabrication of Plastic Devices
|
2019 |
Kreindl, Gerald |
| Design and manufacturing of Roll-to-Roll printed copper layers for communication applications
|
2019 |
Zichner, Ralf |
| Automatic Footprint Compaction and Bond Wire Placement for Bare Die Chips Stacks
|
2019 |
Dittrich, Michael |
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