Effect of Electroless Ni-P Plating on the Bonding Strength of PbTe Thermoelectric Module Using Silver Alloy-Based Brazing

Effect of Electroless Ni-P Plating on the Bonding Strength of PbTe Thermoelectric Module Using Silver Alloy-Based Brazing

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Veröffentlicht in:International Conference on the Physical Properties and Application of Advanced Materials (13. : 2018 : Hanoi) Physical properties and application of advanced materials
1. Verfasser: Bae, S. H. (VerfasserIn)
Weitere Verfasser: Choi, J. Y. (VerfasserIn), Son, I. (VerfasserIn)
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Sprache:eng
Veröffentlicht: 2020
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Effect of Electroless Ni-P Plating on the Bonding Strength of PbTe Thermoelectric Module Using Silver Alloy-Based Brazing 2020 Bae, S. H.
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