Dielectric Analysis of Epoxy Resin/Polyamine Curing (I)

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Veröffentlicht in:Setchaku Kenkyū Happyōkai (22. : 1984 : Takatsuki) Dai 22kai Setchaku Kenkyū Happyōkai
1. Verfasser: KOIKE, Tsuneo (VerfasserIn)
Weitere Verfasser: FUKUZAWA, Takao (VerfasserIn)
Pages:22
Format: UnknownFormat
Sprache:jpn
Veröffentlicht: 1984
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Plastic. Displacement and Fracture of Epoxy Adhesives 1984 NAGAHIRO, Taro
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