Effect of Filler in Adhesives on Weldbonding Properties

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Veröffentlicht in:Setchaku Kenkyū Happyōkai (23. : 1985 : Tokio) Dai 23kai Setchaku Kenkyū Happyōkai
1. Verfasser: YAMADA, Akira (VerfasserIn)
Weitere Verfasser: HARAGA, Kousuke (VerfasserIn)
Pages:23
Format: UnknownFormat
Sprache:jpn
Veröffentlicht: 1985
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