A Study on Crosslinked Acrylic PSAs: Part III -The Effect of Adherends on the Surface Property of the PSA-

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Kōen-yōshishū, Nihon-Setchaku-Gakkai-40.-nenji-taikai
1. Verfasser: ASAHARA, Junko (VerfasserIn)
Weitere Verfasser: HORI, Naruhito (VerfasserIn), TAKEMURA, Akio (VerfasserIn), MATSUI, Hiroaki (VerfasserIn), KIKUCHI, Takeshi (VerfasserIn), DOBASHI, Akihiko (VerfasserIn)
Pages:40
Format: UnknownFormat
Sprache:jpn
Veröffentlicht: 2002
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
Blood Compability and Protein Adsorption Behavior of Amphiphilic Terpolymers 2002 FUKUTA, Katsuya
Preparation and Properties of Epoxy Resins Dispersing Particles of Polypropylene 2002 MIZUTANI, Kenji
Surface Treatment of Cellulosic Fabrics by Plasma Polymerization at Atmospheric Pressure 2002 FUKUMOTO, Yuko
Plasma Polymerization of Ethylene Oxide at Atmospheric Pressure 2002 MIYAMOTO, Hiroki
Nano-DSC Analysis of Enthalpy Relaxation of Poly (Gi-butyl methacrylate) within Particle Dispersed in Water 2002 OKUBO, Masayoshi
Design and Synthesis of Expandable Materials During Polymerization on Crosslinking Based on Transformation of Van der Waals Distance to Covalent Distance 2002 ENDO, Takeshi
Development of Acrylics-Grafted Poylesters 2002 SHIMUZU, Toshiyuki
Switchable Tack by using Side Chain Liquid Crystalline Polymers 2002 CHO, Kilwon
Investigation of the Network Chain Orientation of the Mesogenic Epoxy Resin on the Fracture Process by Using Polarized IR Measurement 2002 HARADA, Miyuki
Bonding Properties of Mesogenic Epoxy Resins 2002 OCHI, Mitsukazu
Emulsion Polymerization with a New Type of Polymeric Emulsifier and Its Property of Film 2002 OKUBO, Masayoshi
The Development of Flexible HM Sealant 2002 YAMADA, Atushi
Relationship between Holding Power and Dynamik Mechanical Property for UV Curable Tape Utilized in Semiconductor Process 2002 AOGAKI, Tomoyuki
Structures and Physical Properties of One-component Epoxy Resins Modidied with Urethaneprepolymer 2002 YAMADA, Eisuke
Analysis of Adhesive Surface between Molding Compound and Metal for Semiconductor Package and Its Applications 2002 ICHIKAWA, Isao
Properties and Functions as Tackifier of Novel Hydrogenated Petroleum Resin with OH Group 2002 NAGAHARA, Eiji
The Characteristics of Shear Strenght and Viscoelastic Properties of Adhesives 2002 TERAMOTO, Kazuyoshi
Properties of UV Curable Coating Film Containing Colloidal Silica Acrylate 2002 Kim, Hyun-Joong
Wood Bonding Performance of Polyvinyl Acetate Emulsion with Reactant PVA as Protective Colloid-Effect of Urethane Modification 2002 SAITO, Toshio
Development of Anti-electrostatic UV Adhesive Tape Utilized in Semiconductor Processing 2002 AOI, Tsuneo
Alle Artikel auflisten