Electrical modeling and design for 3D system integration 3D integrated circuits and packaging signal integrity, power integrity, and EMC

"The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a...

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Bibliographische Detailangaben

1. Verfasser:	Li, Er-Ping (VerfasserIn)
Format:	UnknownFormat
Sprache:	eng
Veröffentlicht:	Hoboken, N.J Wiley-IEEE Press 2012 Hoboken, NJ Wiley 2012
Schlagworte:	Three-dimensional integrated circuits > Integrierte Schaltung > Dreidimensionale Integration
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