IPACK2019-6539 Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris R...

von Hazra, Sougata
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)