The effect of solder alloy, metal particle size and substrate resist on fine pitch stencil printing performance

Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2001)

The effect of metal content and flux chemistry on fine pitch stencil printing perfoirmance using an enclosed print head

Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2001)

Stencil printing of surface mount adhesives and conductive adhesive

Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2001)

Surface insulation resistance and the properties of conformal coatings

von Tomlins, P.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2000)

A method to quantify the surface insulation resistance performance to glob-tops exposed to different temperature/humidity conditions

von Tomlins, P.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2000)

Surface insulation resistance performance to glob-tops exposed to different temperature/humidity conditions

von Tomlins, P.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2000)

JANUS HOLLOW FIBER MEMBRANE-BASED DCMD PROCESS FOR DESALINATION OF HIGH-SALINITY OILFIELD PRODUCED WATER

von Zou, L.
Veröffentlicht in WEFTEC connect (Veranstaltung : 2020 : Online) 93rd Water Environment Federation Technical Exhibition and Conference (WEFTEC 2020) ; Volume 5 of 6 (2021)

MATERIAL SOLUTIONS FOR EV BATTERY ASSEMBLY: THERMAL MANAGEMENT AND FIRE PROTECTION

von Richeton, J.
Veröffentlicht in Battery Engineering Symposium (2020 : Wiesbaden) Battery Engineering Symposium 2020 (2020)

The influence of thermal cycling on the adhesion of conformal coatings

von Tomlins, P.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2000)

DYNAMIC ADJUSTMENT OF A VSC'S REACTIVE CURRENT LIMIT TO IMPROVE FREQUENCY STABILITY

von Fradley, J.
Veröffentlicht in International Conference on AC and DC Power Transmission (17. : 2021 : Online) 17th International Conference on AC and DC Power Transmission (ACDC 2021) (2022)

08146 - Pipeline Corrosion Monitoring by Fiber Optic Distributed Strain and Temperature Sensors

von Zou, L.
Veröffentlicht in NACE International Corrosion 2008 ; Vol. 2 (2008)

Tack testing of solder paste in tension and shear

von Brewin, A.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2001)

Code of practice for electronic materials dispensing

von Brewin, A.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2001)

Rheology testing of solder pastes and conductive adhesives : a guide

von Dusek, M.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2002)

A kind of QT-Bézier curves and its applications

von Xie, J.
Veröffentlicht in IMSS International Conference on Future Manufacturing Engineering (2014 : Hongkong) Advances in future manufacturing engineering (2015)

Stability of electronic components in lead-free processing

von Brewin, A.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2001)

An assessment of the suitability of current pcb laminates to withstand lead-free reflow profiles

von Wickham, M.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2001)

Tack testing of electronic adhesives in tension and shear

von Brewin, A.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2001)

Test method for dispensing electronic process materials

von Brewin, A.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2002)

Rheology testing of solder pastes and conductive adhesives used in stencil printing

von Dusek, M.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2002)