Examining the role of patent quality in large-scale "patent war" litigation : a historical comparison and proposal for a restorative U.S. patent system

von Zohni, Wael
Veröffentlicht 2018

Bridging Between 3D Stacking and 3D IC Technologies

von Zohni, Wael
Veröffentlicht in 2013 IEEE CPMT Symposium Japan (formerly VLSI Packaging Workshop of Japan) (2013)

High Density Package Solutions for Next-Generation Smartphone, Ultrabook and Tablet Computing

von Solberg, Vern
Veröffentlicht in 2012 2nd IEEE CPMT Symposium Japan (2012)