IPACK2018-8210 Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump

von Wu, Ruikang
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2018-8211 Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

von Yu, Xingjian
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2018-8301 Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs Silica-on-Chip Structure

von Xie, Bin
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)