Emission Issue of Formaldehyde and other VOCSs

von YOSHIDA, Hiroaki
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-39.-nenji-taikai (2001)

Bond Durability of Thermosetting Water-Based Polymer-Isocyanate Adhesives (API Resin) for Wood

von YOSHIDA, Hiroaki
Veröffentlicht in Setchaku Kenkyū Happyōkai (27. : 1989 : Tokio) Dai 27kai Setchaku Kenkyū Happyōkai (1989)

Quantitative Estimation of Bond Durability of Wood-Based Materials (1) - Deterioration of Bond Quality of UF-resin by Damp and Temperature

von YOSHIDA, Hiroaki
Veröffentlicht in Setchaku Kenkyū Happyōkai (24. : 1986 : Osaka) Dai 24kai Setchaku Kenkyū Happyōkai (1986)

Quantitative Prediction of Bondline Durabilty

von YOSHIDA, Hiroaki
Veröffentlicht in Setchaku Kenkyū Happyōkai (29. : 1991 : Nagoya) Dai 29kai Setchaku Kenkyū Happyōkai (1991)

Physical Praperties and Bond Qualities of One-Part Polyurethane Adhesives

von KIMURA, Mitsukazu
Veröffentlicht in Setchaku Kenkyū Happyōkai (31. : 1993 : Tokio) Dai 31kai Setchaku Kenkyū Happyōkai (1993)

Physical Properties of One-Part Polyurethane Adhesives

von KIMURA, Mitsukazu
Veröffentlicht in Setchaku Kenkyū Happyōkai (30. : 1992 : Tokio) Dai 30kai Setchaku Kenkyū Happyōkai (1992)

Thermal Analysıs and Bond Quality of Thermosetting Resin Adhesives

von SATO, Yuri
Veröffentlicht in 35 Nihon Setchaku Gakkai nenji taikai kōen yōshishū (1997)

Kūkai shisō no keisei

von Yoshida, Hiroaki
Veröffentlicht 51993

Physical Properties and Bond Quality of Epoxy Resin for Timber Construction

von MATSUL, Noriko
Veröffentlicht in 34 Nihon Setchaku Gakkai nenji taikai kōen yōshishū (1996)

Creep Bahaviors of Two-Ply Beams Laminated with Various Adhesives

von ITO, Masamitsu
Veröffentlicht in Setchaku Kenkyū Happyōkai (29. : 1991 : Nagoya) Dai 29kai Setchaku Kenkyū Happyōkai (1991)

Physical Properties and Bond Qualities of Wood Adhesives Effective Bond Area, Shear Strength

von TAKI, Kinji
Veröffentlicht in Setchaku Kenkyū Happyōkai (29. : 1991 : Nagoya) Dai 29kai Setchaku Kenkyū Happyōkai (1991)

Sayō-sokan-ni-okeru-jiyū-seki-to-sono-shūhen : [Kyōto, June 5 - 7, 2000]

Veröffentlicht 2000

Physical Property and Wood Bonding Performance of Acrylic Resin Emulsion with Acetoacetylated PVA as Protective Colloid(1)

von SHINOHARA, Hiroki
Veröffentlicht in Kōen-yōshishū, soritsu-40-shūnen-kinen, Nihon-Setchaku-Gakkai-42.-nenji-taikai (2004)

Studies on the Properties of Wood Based Material Flexible Sheet

von TAKI, Kinji
Veröffentlicht in Setchaku Kenkyū Happyōkai (28. : 1990 : Osaka) Dai 28kai Setchaku Kenkyū Happyōkai (1990)

Creep Test of Wood Adhesives using Modified ASTM-Block Shear Type Testing Method

von YOSHIDA, Hiroaki
Veröffentlicht in Kōen-yōshishū, sōritsu-35-shūnen-kinen, Dai-37-kai-nenji-taikai (1999)

Bond Quality of Sulfomethylated-Phenol Alkylresorcinol Formaidehyde Resin Adhesives (S-PAF)

von NISHINO, Yoshiki
Veröffentlicht in 34 Nihon Setchaku Gakkai nenji taikai kōen yōshishū (1996)

Testing Method and Estimation of the Mutability on Adhesives for Wood

von AIBA, Tamito
Veröffentlicht in 33 Nihon Setchaku Gakkai nenji taikai kōen yōshishū (1995)

ISPS/MIPE2018-8551 Coarse-Grain Simulation of Lubricant Polymer Solutions

von Washizu, Hitoshi
Veröffentlicht in ASME/JSME Joint International Conference on Information Storage and Processing Systems and Micromechatronics for Information and Precision Equipment (2018 : San Francisco, Calif.) Proceedings of the ASME/JSME Joint International Conference on Information Storage and Processing Systems and Micromechatronics for Information and Precision Equipment - 2018 (2018)

Durability of Acid - Catalyzed Phenolic Resin Adhesives

von HASEBE, Takuya
Veröffentlicht in Setchaku Kenkyū Happyōkai (32. : 1994 : Tokio) Dai 32kai Setchaku Kenkyū Happyōkai (1994)

Distributed Range-based Localization for Swarm Robot Systems using Sensor-fusion Technique

von Inoue, Daisuke
Veröffentlicht in SENSORNETS (8. : 2019 : Prag) SENSORNETS 2019 (2019)