Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (EuroSimE 2011) [... 12th International Conference on Thermal, Mechanical an...

Veröffentlicht 2012

2012 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : [... 13th ... Cascais, near Li...

Veröffentlicht 2013

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (EuroSimE 2007); Imaps Poland 2007

Veröffentlicht 2008

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and microsystems (EuroSimE 2013) : [... 14th International Conference on ... Wrocław, Polen...

Veröffentlicht in Reliability and variability of devices for circuits and systems (ICMAT 2013) (2014)

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and microsystems (EuroSimE 2014) : [... 15th International Conference on ... Ghent, Belgium...

Veröffentlicht 2015

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (EuroSimE) : Polytronic 2005 ; [... papers presented at the International...

Veröffentlicht 2007

Numeryczne metody projektowania termomechanicznego w montażu elektronicznym

von Wymysłowski, Artur
Veröffentlicht 2007

Imaps Poland 2007 : [The 31st IMAPS Poland international conference was held in the Castle-and-Park Complex Krasiczyn ... took place between 23 and 26 September 2007 ... eleven p...

Veröffentlicht in Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (EuroSimE 2007); Imaps Poland 2007 (2008)

Special section: thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (EuroSimE 2015)

Veröffentlicht 2016

Molecular modeling and multiscaling issues for electronic material applications

Veröffentlicht 2015

Special issue: 2016 EuroSimE, International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Veröffentlicht 2017