IPACK2022-97433 Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

Planning the city operations of a parcel express company

von Wu, Haotian
Veröffentlicht in Omega (2022)

IPACK2020-2675 Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

IPACK2021-74061 Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

Video-based Machine Learning System for Commodity Classification

von He, Pan
Veröffentlicht in VEHITS (6. : 2020 : Online) VEHITS 2020 (2020)

IPACK2020-2677 Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150 degrees C to 200 degrees C

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

Research on the Comprehensive Geological Prediction Method on a Metro Tunnel Karst Disaster and the Numerical Simulation of Corresponding Treatment Measures

von Li, Shucai
Veröffentlicht in Geo-China (Veranstaltung : 4. : 2016 : Shandong) Emerging technologies in tunnel engineering, modeling, design, construction, repair, and rehabilitation (2016)

IPACK2021-74075 Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)