3D Integration using Heterogeneous System-in-Package (HSIP) Technology

von Woychik, Charles
Veröffentlicht in SMTA International Conference (2020 : Online) SMTA International Conference 2020 (2021)

High Performance RF Diplexer Module Using a Glass Interposer

von Woychik, Charles
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)