IPACK2020-2699 Molecular Dynamics Investigation of Water Behavior Through Nanopores

von Montazeri, Kimia
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

IPACK2021-69751 A Review on the Current Industrial Uses and the Future Outlook of Battery Thermal Management Systems for Electric Vehicles

von Choi, Nicholas
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

IPACK2018-84560 Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

von Le, Duong Vy
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2019-6307 Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings

von Pham, Quang N.
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2019-6372 Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive - Fluorescence Dyes

von Suh, Youngjoon
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2020-2613 Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

von Quach, Nhi V.
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

IPACK2022-96542 Machine Learning Enables Autonomous Vehicles Under Extreme Environmental Conditions

von Quach, Nhi V.
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)