IPACK2022-97446 Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling

von Clarke, Zion
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

IPACK2019-6442 Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization

von Whitt, Reece
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)