Influence of Thermal Cycle Dwell Time on the Mechanical Properties of SAC-Bi Solder Joints

von Wentlent, Luke
Veröffentlicht in SMTA International Conference (2020 : Online) SMTA International Conference 2020 (2021)

Reliability Behavior of Surface Mount Devices Assembled with Bismuth Bearing Low-Melt Solder Pastes

von Wentlent, Luke
Veröffentlicht in SMTA International Conference (2020 : Online) SMTA International Conference 2020 (2021)

LTS 573: Thermal Cycling Behaviors of Hybrid and Homogeneous Low Temperature Solder Interconnects

von Wentlent, Luke
Veröffentlicht in SMTA International Conference (2021 : Minneapolis, Minn.; Online) 2021 SMTA International Conference ; Volume 2 of 2 (2022)

Reliability Behavior of Surface Mount Devices Assembled with Bismuth Bearing Low-Melt Solder Pastes

von Wentlent, Luke
Veröffentlicht in TMS Annual Meeting & Exhibition (149. : 2020 : San Diego, Calif.) TMS 2020 149th Annual Meeting & Exhibition supplemental proceedings ; Volume 1 (2020)

LTS 572: Solder Ball Drift Behavior of Hybrid SnAgCu-LTS Solder Interconnects in Accelerated Thermal Cycling

von Wentlent, Luke
Veröffentlicht in SMTA International Conference (2021 : Minneapolis, Minn.; Online) 2021 SMTA International Conference ; Volume 2 of 2 (2022)

Microstructure and Mechanical Properties of SAC-Bi Solder Alloys with Aging

von Hamasha, Sa'd
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)